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Technology Requirements:
Material FR4, other materials available
Layer 1-22layers
Max. finished board size 600*800mm
Board finished thickness 0.4-3.2mm
Min.line width/***ce 4mil(0.1mm)
Min.hole size 3mil(0.075mm)
Copper thickness 0.5-6oz
Solder mask color green/yellow/black/white/red/blue
Surface finishing HAL/HASL, Chemical tin, Chemical Gold,
Immersion Silver/Gold, OSP
Inner packing Vacuum packing
Certificate: UL, ISO 9001, ISO 14001, RoHS
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| Company: |
Shenzhen Confidence MTP Industry Technology Ltd
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| Contact: |
Ms. Li Xiang |
| Address: |
Nanhai Street,Nanshan Dist |
| Postcode: |
518054 |
| Tel: |
+86-0755-86183611 |
| Fax: |
+86-0755-86183620 |
| E-mail: |
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