Technology Requirements:
Material FR4, other materials available Layer 1-22layers Max. finished board size 600*800mm Board finished thickness 0.4-3.2mm Min.line width/***ce 4mil(0.1mm) Min.hole size 3mil(0.075mm) Copper thickness 0.5-6oz Solder mask color green/yellow/black/white/red/blue Surface finishing HAL/HASL, Chemical tin, Chemical Gold, Immersion Silver/Gold, OSP Inner packing Vacuum packing
Certificate: UL, ISO 9001, ISO 14001, RoHS
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